Tag: solder paste inspection

S8080 3D Solder Paste Inspection (SPI). Measures volume, height, and area on every pad before component placement. Catches printing defects early — the cheapest fix in the entire SMT process.

PCB testing is not a luxury — it is the line between shipping confidence and shipping risk. This guide maps the full testing pyramid from incoming QC through SPI, AOI, ICT, FCT, and system-level validation, explaining what each stage catches and why